Fullway copper industry

In addition, in the high-temperature liquid phase sintering process, it was found that the size of the tungsten and copper powders also affect the sintered fine density of the tungsten-copper composite material. 3.) in trace amounts (0. The basic situation will be introduced below. The study indicates that Co and Fe have the best activation effect, which can significantly improve the fine density of tungsten-copper materials.

Therefore, in order to improve the density of the material, after the liquid phase sintering, it is necessary to add related post-treatment processes such as repressing, hot pressing, and hot forging, etc.. Activation strengthened liquid phase sintering can make tungsten-copper materials achieve higher relative density, hardness, bending strength and other functions. They pre-fired tungsten skeletons prepared at 900 ℃ and infiltrated at 1500 ℃ for 9O～120min.

The traditional method is usually to perform high-temperature liquid phase sintering at a temperature above 300℃ above the melting point of copper to make it denser. Activated liquid phase sintering Activated liquid phase sintering is a method of selecting a third metal element (Pd, Ni, Co, Fe, etc. Therefore, tungsten-copper composite materials can only be prepared by powder metallurgy. Therefore, the material prepared by this method is only suitable for occasions where the electrical conductivity and thermal conductivity are not required. Ultra-fine/nano-powder and one-step sintering near-full-density method

The ultra-fine/nano powder has a series of excellent features such as fine grains of the powder, large specific surface area, large touch interface between powders, and large surface activity. Compared with the high-temperature liquid phase sintering method, this method not only reduces the sintering temperature, shortens the sintering time, and greatly improves the sintering density. .'s study of the WlOcu system also indicated that when the Co content is 0. Therefore, the tungsten-copper composite material prepared with ultra-fine powder has a very high fine density, high thermal conductivity, very fine and uniform micro-arrangement copper tape for RF cable structure, and has the unparalleled advantages of the traditional tungsten-copper composite material prepared by the conventional method. 1.